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Engineering (Physical & Sciences)
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#91109 Senior Nanofabrication Engineer

Extended Review Date: Tue 1/23/2018

Posting will remain "Open Until Filled"

DESCRIPTION

Uses advanced engineering concepts and campus objectives to lead and perform the work of an engineering team engaged in a specialized engineering field on a training and / or research program. Manages nano- and micro-fabrication, metrology and analytical equipment, including state-of-the-art Electron-Beam Lithography Equipment, several Emission Scanning Electron Microscopes, Dual-beam (focused ion-beam) Equipment, and provides complex and novel nanoscale fabrication services for a highly varied academic and industrial user base.

Regularly works on highly complex issues where analysis of situations or data requires an in-depth evaluation of variable factors. Provides individual user training and services on highly complex micro/nano-analytical equipment, manages tools in the microscopy functional area of the facility, and performs additional managerial/administrative functions as assigned. Exercises independent judgment in selecting methods, techniques and evaluation criteria for obtaining results.

QUALIFICATIONS

  • Advanced knowledge associated with the planning, development, and fabrication of engineering systems.

  • Demonstrated five (5) years of Nanofabrication experience. Advanced knowledge of specialized design work as well as the overall field.

  • Advanced knowledge of the physics and technology of electron beam systems.

  • Extensive experience in operation of scanning electron microscopes and focused-ion-beam instrumentation, including experience with SEM analysis of materials ranging from biological to inorganic.

  • Thorough understanding of the physics involved in the SEM techniques. Ability to convey relevant information to train novice users to become independent operators of SEM systems.

  • Strong project management skills needed to assume responsibility for accomplishment of research objectives. Ability to lead, motivate and influence others. Readily assess complex challenges and barriers and recommend effective resolutions.

  • Advanced communication skills, both written and verbal, to convey complex information in a clear and concise manner. Strong interpersonal and presentation skills. Ability to work in a highly collaborative manner.

  • Graduation from college with major work in engineering (including College level knowledge in electronic device physics, mathematics, chemistry) and five (5) years of engineering experience including two(2) years in specialized design work; or an equivalent combination of additional education and experience.

  • Proven working knowledge in UV optics, optical lithography, and photochemistry for photolithography process for fine pattern definition and transfer and the processes of resist exposure, baking and development.

  • Detailed knowledge of chemical safety. Ability to work safely with hazardous materials.

  • Proven knowledge and skills to complete special techniques on precision mechanics, with the ability to handle components about 0.1 mm in size and perform such tasks as landing multiple metal wires, 0.02 mm wide each, on the semiconductor chip.

  • Ability to set control knob parameters individually and collectively and knowledge of how settings will affect the final process.

  • Advanced knowledge in semiconductor device physics and technology.

  • Demonstrated understanding of the concerns of the users and the process tolerance of their devices.

  • Demonstrated knowledge in UHV (ultra-high-vacuum) systems with the ability to operate machines in UHV conditions.

  • Demonstrated knowledge of surface metrology to measures the surface profile with an accuracy down to a single atomic level (i.e. 0.3 nm).

  • Demonstrated experience with both mechanical and optical tools for surface metrology, including AFM, STM, ellipsometer, interferometric microscope, etc.

  • Demonstrated experience with both electronic circuit and control principles for process control, monitoring, and sample handling of sophisticated electronic control mechanisms.

  • Strong knowledge of CAD tools (such as L-Edit and Auto-CAD, or similar software) for device layout for microfabrication. The mask set is typically produced with electron beam lithography according to the layout (typically encoded in GDS format).

  • Strong computer skills (i.e. word, excel, powerpoint, etc.) to perform teaching tasks, generate user record and financial data, and to communicate with users. Ability to create professional reports, lab manuals, instruction manuals, graphs, charts, and spreadsheets.

  • Working knowledge of Linux operating system and scripting programming language.

  • Extensive working knowledge in surface chemistry and physics, especially in such areas as reactions between gases and semiconductors, plasma enhanced chemical reactions, and physical/chemical processes in material etch and deposition.


The University of California is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability, age, protected veteran status, gender identity or sexual orientation. For the complete University of California nondiscrimination and affirmative action policy see: http://www-hr.ucsd.edu/saa/nondiscr.html

UC San Diego is a smoke and tobacco free environment. Please visit smokefree.ucsd.edu for more information.

UCSD
Payroll Title:
RSCH AND DEV ENGR 4
Department:
CA INSTIT TELECOM/INFO TECH
Hiring Salary Range
$78,900 - $104,150 /year
Worksite:
Campus
Appointment Type:
Career
Appointment Percent:
100%
Union:
Uncovered
Total Openings:
1
Work Schedule:
Days, 8 hrs/day, M-F